Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.
The Chosun Ilbo on MSN
Samsung Electro-Mechanics invests 1.8T won in Vietnam for FC-BGA expansion
Samsung Electro-Mechanics is making an investment of 1.8 trillion Korean won in Vietnam to expand production capacity for ...
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